http://cern.ch/ssd/bond

Background 

The mass production of the silicon tracker modules for the LHC detectors is about to start. CERN and its numerous collaborating institutes have geared up to cope with a real challenge: the combination of an unprecedented production volume, a high technical complexity, global logistics, tight schedules and limited resources.

Our previous Workshop on Quality Assurance Issues  has been considered a great success. It focused on silicon sensor testing and characterization with emphasis on radiation hardness and allowed for a broad exchange of knowledge and experience between the LHC experiments, with highly appreciated inputs from Fermilab, DESY and other labs.

In the same spirit we are now organizing a workshop with the topic 

"Bonding and Die Attach Technologies".

Scope

The scope of this workshop spans  

• wire and TAB bonding, 
• bump bonding, 
• gluing techniques,
• methods to assess the bond quality. 

The workshop will review the bonding techniques, currently applied to detector construction, and try to estimate their technological prospects. The participation of companies, being involved in the fabrication of PCBs, hybrids, pitch adapters or wire and bump bonds is highly welcome. 

An equally important goal is to provide a platform for exchanging knowledge and practical experience between the various institutes and detector collaborations. The active participation of technicians and bond operators is considered as particularly valuable.

When and Where ?

The workshop will be held 

• at CERN on June 11 and 12, 2003 (Wednesday and Thursday). 

The date has been chosen because it is linked to a CMS general week (2-6 June) and ATLAS SCT/ PIXEL weeks (13-19 and 16-21 June)

• All presentations will take place in the room 40-SS-C01 (location of building 40)

Presentations

We foresee three different types of presentations

• Technological overviews, 30'' + 10'' discussion
• Overviews by experiments, 20''  + 5'' discussion
• Short talks on specific topics, problems and experience, 10-15'' + 5" discussion 

Extended coffee breaks will provide time for discussions between technicians on practical problems & solutions and allow companies to establish contacts to customers.

Proceedings

We do not intend to publish any written proceedings or papers. The speakers are kindly asked to provide electronic versions (pdf) of their transparencies, which will be made available on the workshop webpage. 

Registration & Dinner & Accommodation

Attendance of the workshop is free of charge (except of dinner). Please use the electronic registration form on this website. Coffee and croissants will be served. The workshop dinner will be organized on Wednesday evening (11 June). The fee of 60 CHF includes bus transport between CERN and the restaurant. The CERN-Hostel has a limited number of rooms, therefore we recommend early reservation.