Divisional Silicon Facility - Bond Lab

Treatment of irradiated (radioactive) devices

In addition to the standard work request (How do I get my work done?), the following procedure has to be followed to handle radioactive material in the bond lab:

• Fill the following work form "Appendix A - Radioactive material" (doc, pdf) and take an appointment with the Radioprotection Group in the Safety Commission (SC-RP).
             1^st Contact:       Gilbert Bertuol (160647) 
             2^nd contact:       73171            
  (Upon your request SC-RP might be willing to perform the measurement the bond-lab if your devices are delicate to handle or easy breakable..)
   
• CS-RP will measure the activity of your device and decide whether
   a) your devices can be handled in the bond lab,
   b) your devices can be handled with special preparation only or  
   c) the handling needs major preparation or is not possible at all.
   
• Upon arrival in the bond lab your devices will be checked for their radioactivity level again by a bond technician.

Note:

• We will accept radioactive devices only in properly labeled boxes !
• Try to minimize the time the devices are located in the bond lab !

Some additional information

• All bond technicians handling the radioactive devices will have to wear film badges

Status: 19/11/04

(Michael Moll)