• 3 automatic wire bonders DELVOTEC 6400

  The DELVOTEC 6400 is a fully automatic wedge bonder for Aluminum wires. Our machines are operated with Al wires of 25 mm diameter (however also 18 mm have been used, and larger diameters up to 75 mm are in principle possible). The accessible work area is 150 x 200 mm, 25 mm in z (vertical). 
  
  Information from the Delvotec web page:   Description , Specifications

  Bonding clearance around the tool of the 6400 is shown on this page.

Machine 1	Machine 2	Machine 3

• Die bonder, CAMMAX DB 600

The CAMMAX DB600 allows to precisely place and glue chips on hybrids. Equipped with a heated work stage the device can be used for die adjust by thermo plastic foils and is also well suited for rework (removal of glued chips). 

CAMMAX DB 600 Info from the CAMMAX web page: Description

• Automatic wire bond pull tester Dage 4000

The Dage 4000 allows to perform wire bond pull tests in a very controlled and reproducible way, both in destructive and non-destructive mode. This allows to characterize the bond and so to optimize the bonding parameters.

Dage 4000  Dage

• Wafer prober SÜSS Microtech PA200HR

Our SUSS PA200 Semiautomatic Probe System is designed for high resolution (HR) applications. It is a very stable, modular and flexible probe systems for wafers and substrates up to 200 mm (8"). The standard ProberBench® Operating System provides ease of use and programmed automation for the most demanding analytical applications. The modular design is effective, versatile and has a defined upgrade path....

SÜSS Microtech PA200HR Brochure Suess Microtech

• CMM - OGP Smartscope CNC250

SmartScope® CNC™ 250 is a compact machine designed for easy access to the XY stage for maximum fixturing flexibility. Its large 300mm X travel makes it the system of choice for measuring critical dimensions of long parts on a benchtop machine. Its heavy cast base and rigid steel column provide metrology integrity so accuracy is maintained in real world environments.

	measuring range	accuracy
X	300 mm	(2.5+6L/1000) µm
Y	150 mm	(2.5+6L/1000) µm
Z	200 mm	(2.0+5L/1000) µm

 

OGP Smartscope CNC250 OGP - CNC250 B&S Messtech - CNC250

 

• Various probe stations 

The bond lab is equipped with various probe stations and inspection microscopes, partly belonging to other groups or experiments. 

• Ultrasound cleaning station
• Plasma cleaning oven (transferred to TS/DEM)
• Oven for hardening epoxy glues 
• Microscopes for inspection  

  1 x Leica MZ16: (brochure)
  Zoom ratio (16:1) provides standard magnification from 7.1x – 115x including 10x eyepiece, 2x objective

  2 x WILD - M3Z:
  Stereo Microscope. Zoom ratio (6:1), Zoom Range: 6.5 to 40 with included 10 x eyepiece, 1.5X objective           
   

12/09/06   (MM)