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| side view, click to enlarge | front view, click to enlarge |
Clearance under the bond head - Delvotec 6400 |
The geometry of the bond head (tool, clamp, wire feed tube, transducer etc., see below) poses restrictions on the height of electrical components or any other objects in the vicinity of the bond pads.
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| side view, click to enlarge | front view, click to enlarge |
Back to: DSF bond lab - DSF - PH-DT2-SD |
Status: 08/12/05 (Christian Joram - Ian Mcgill)