Divisional Silicon Facility - Bond Lab

Other related CERN sevices

EST-DEM group (hybrid / PCB design, layout, production) 

 

Bonding machines / tools

HILPERT Electronics home page

DELVOTEC home page

Kulicke & Soffa (K&S) home page

K&S bond tools (micro-swiss, Israel)

Gaiser Tools

Tools from Erosionstechnik Neudegger (through SITEST, UK)

Microminiature Technology Tools

Hesse & Knipps home page 

 

Other companies

thermoplastic films (STAYSTIK) 

Dage Group home page (Bond tester)

Royce Instruments (semiconductor test equipment)

SIREL clean room and antistatic equipment 

LEICA Micorsystems (microscopes etc.)

NIKON (microscopes + semiconductor equipment) 

Olympus (microscopes etc.)

 

Useful articles

Article about die attach processes 

Article about wire bonding processes 

Article about process characterization, optimization and control 

Status: 05/11/02

(Christian Joram)