side view, click on drawing to enlarge
front view, click on drawing to enlarge
Divisional Silicon Facility - Bond Lab
Clearance under the bond head
The geometry of the bondhead (tool, clamp, wire feed tube, transducer etc., see below) poses restrictions on the height of electrical components or any other objects in the vicinity of the bond pads
|
side view, click on drawing to enlarge |
front view, click on drawing to enlarge |
Status: 04/11/02
(Christian Joram - Ian Mcgill)