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PH Department Silicon Facility Bond Lab |
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PH Department Silicon Facility Bond Lab |
The bond lab is part of the PH Department Silicon Facility. It is run by the section PH/DT2-SD.
We provide support in fine pitch wire bonding and die attach. You find us in 186/R-G016
In the lab 28-2-019 a test bench is available to DSF users who want to measure IV and CV characteristics of Si sensors.
Organization of the bond lab - Bonding Request How to get your job done ?
Die attach (under construction)
Testing of bonds (under construction)
Recommendations for the designs of hybrids (from the bonder's perspective)
Handling of irradiated devices (under construction)
| Contacts:
Michael Moll 72495, 164756 Bond Lab telephone: 75723
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CERN wire bonder's coffee corner Wire bonders and hybrid makers (TS/DEM) meet typically once a month. Problems, experience and tricks can be discussed over a cup of coffee. If you are interested to participate, contact M.Moll or E. van der Bij. |
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13/12/05 (MM)
