Divisional Silicon Facility - Bond Lab

The Equipment of the Bond Lab

• 3 automatic wire bonders DELVOTEC 6400.

The DELVOTEC 6400 is a fully automatic wedge bonder for Aluminum wires. Our machines are operated with Al wires of 25 mm diameter (however also 18 mm have been used, and larger diameters up to 75 mm are in principle possible). The accessible work area is 150 x 200 mm, 25 mm in z (vertical). 

Bonding clearance around the tool of the 6400 is shown on this page.

• 1 automatic wire bonders DELVOTEC 6319, owned by EPFL Lausanne..

The DELVOTEC 6319 is the predecessor of the 6400.

• 1 die bonder, CAMMAX DB 600

The CAMMAX DB600 allows to precisely place and glue chips on hybrids. Equipped with a heated work stage the device can be used for die adjust by thermo plastic foils and is also well suited for rework (removal of glued chips). 

• 1 automatic wire bond pull tester Dage 2400A

The Dage 2400 A allows to perform wire bond pull tests in a very controlled and reproducible way, both in destructive and non-destructive mode. This allows to characterize the bond and so to optimize the bonding parameters. The tester can also be used to perform shear tests, i.e. to assess the strength of adherence of chips on substrates.

• various probe stations 

The bond lab is equipped with various probe stations and inspection microscopes, partly belonging to other groups or experiments. 

• Ultrasound cleaning station
• Plasma cleaning oven
• Oven for hardening epoxy glues           

Status: 12/10/04

(CJ)