Workshop on 
Bonding and Die Attach Technologies

11-12 June 2003 at CERN, Geneva, Switzerland

 

Workshop Program and Transparencies Last Udpate: 24/06/2003

 

The Workshop takes place in Bldg. 40 - Room 40-SS-C01 -  Where to find Building 

See abstracts of registered talks under Registered talks


Wednesday 11 June, 9:00    Introduction 
Workshop Opening  (pdf, 75KB) Christian Joram, CERN

I. Overview talks 

 
- Aluminum Wedge Bonding Josef Sedlmair, Delvotec
- Flip chip for Si pixel detectors (pdf, 370KB) Michael Campbell, CERN
- Bump bonding technology (pdf, 1MB) Jorma Salmi, VTT
10:40-11:00 coffee break
II. Experiment specific talks

 

- ALICE (pdf, 1.5MB) Petra Riedler, CERN
- Assembly and wire bonding of the ALICE SPD (pdf, 845KB) Romualdo Santoro, Bari 
- Wire bonding and die attach in CMS (pdf, 2.5MB) Alan Honma, CERN
12:30 - 14:00 Lunch
- Wire Bonding Quality Assurance and Testing Methods (pdf, 5.6MB)  Martin Schneider-Ramelow, IZM Berlin
II. Experiment specific talks  
- D0 + CdF (pdf, 3.8MB) Eric Kajfasz, CPMM, IN2P3
- LHCb Vertex Detector (VELO) Hybrid (ppt 4.4 MB) Themis Bowcock, Liverpool
15:30 - 15:50 coffee break
III. Special talks: 

 

- What can go wrong in wire bonding ? (pdf, 84KB) Ian Mcgill, CERN
- CDF Silicon detector wire-bond failures induced by resonant vibrations (pdf, 1.63 Mb) Reid Mumford, CdF
- Open discussion - experience exchange ALL
20:00  Conference dinner (more details here). 
 
Thursday 12 June, 9:00
IV. Overview talks: 

 

- Metallurgies for bonding (pdf, 880KB) Rui de Oliveira, CERN
- Status of the CMS bump bonder (pdf, 906KB) Stephan Heising
10:40-11:00 coffee break
Special talks:

 

- ATHENA (pdf, 1.2MB) Petra Riedler
- Wire bond testing in AMS (pdf, 580KB) Florin Cotorobai (G&A Engineering)
- ACF bonding tests for the ALICE TRD signal cables (pdf, 2.5MB) David Emschermann (Heidelberg) - Antoine Lebrun (Strasbourg)
- Advanced bond head technology for improved bond quality H.J. Hesse, Hesse&Knipps
12:30 - 14:00 Lunch
Special talks: 

 

- Bump-bonding and packaging issues in pixel Hybrid  Photon Detectors (pdf, 2.5MB) Thierry Gys, CERN
- Bump bonding of PILATUS multi chip modules (pdf, 2.5MB) Christian Brönnimann, PSI
- Experience with the module assembly for the CMS Preshower (pdf, 278KB) Anna Elliot-Peisert
15:30 - 15:50 coffee break
- Visit of CERN Silicon Facility / Bond lab (max 10 persons) Ian Mcgill
- Visit of CERN PCB workshop (max 10 persons) Rui de Oliveira
17:30  End of Workshop

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