|
Workshop
on Bonding and Die Attach Technologies 11-12 June 2003 at CERN, Geneva, Switzerland |
Workshop Program and Transparencies Last Udpate: 24/06/2003 |
The Workshop takes place in Bldg. 40 - Room 40-SS-C01 - Where to find Building
See abstracts of registered talks under Registered talks
Wednesday 11 June, 9:00 Introduction | |
Workshop Opening (pdf, 75KB) | Christian Joram, CERN |
I. Overview talks |
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- Aluminum Wedge Bonding | Josef Sedlmair, Delvotec |
- Flip chip for Si pixel detectors (pdf, 370KB) | Michael Campbell, CERN |
- Bump bonding technology (pdf, 1MB) | Jorma Salmi, VTT |
10:40-11:00 coffee break | |
II. Experiment specific talks |
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- ALICE (pdf, 1.5MB) | Petra Riedler, CERN |
- Assembly and wire bonding of the ALICE SPD (pdf, 845KB) | Romualdo Santoro, Bari |
- Wire bonding and die attach in CMS (pdf, 2.5MB) | Alan Honma, CERN |
12:30 - 14:00 Lunch | |
- Wire Bonding Quality Assurance and Testing Methods (pdf, 5.6MB) | Martin Schneider-Ramelow, IZM Berlin |
II. Experiment specific talks | |
- D0 + CdF (pdf, 3.8MB) | Eric Kajfasz, CPMM, IN2P3 |
- LHCb Vertex Detector (VELO) Hybrid (ppt 4.4 MB) | Themis Bowcock, Liverpool |
15:30 - 15:50 coffee break | |
III. Special talks: |
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- What can go wrong in wire bonding ? (pdf, 84KB) | Ian Mcgill, CERN |
- CDF Silicon detector wire-bond failures induced by resonant vibrations (pdf, 1.63 Mb) | Reid Mumford, CdF |
- Open discussion - experience exchange | ALL |
20:00 Conference dinner (more details here). | |
Thursday 12 June, 9:00 | |
IV. Overview talks: |
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- Metallurgies for bonding (pdf, 880KB) | Rui de Oliveira, CERN |
- Status of the CMS bump bonder (pdf, 906KB) | Stephan Heising |
10:40-11:00 coffee break | |
Special talks: |
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- ATHENA (pdf, 1.2MB) | Petra Riedler |
- Wire bond testing in AMS (pdf, 580KB) | Florin Cotorobai (G&A Engineering) |
- ACF bonding tests for the ALICE TRD signal cables (pdf, 2.5MB) | David Emschermann (Heidelberg) - Antoine Lebrun (Strasbourg) |
- Advanced bond head technology for improved bond quality | H.J. Hesse, Hesse&Knipps |
12:30 - 14:00 Lunch | |
Special talks: |
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- Bump-bonding and packaging issues in pixel Hybrid Photon Detectors (pdf, 2.5MB) | Thierry Gys, CERN |
- Bump bonding of PILATUS multi chip modules (pdf, 2.5MB) | Christian Brönnimann, PSI |
- Experience with the module assembly for the CMS Preshower (pdf, 278KB) | Anna Elliot-Peisert |
15:30 - 15:50 coffee break | |
- Visit of CERN Silicon Facility / Bond lab (max 10 persons) | Ian Mcgill |
- Visit of CERN PCB workshop (max 10 persons) | Rui de Oliveira |
17:30 End of Workshop |
Workshop on Bonding and Die Attach Technologies, CERN SSD Home-Page Workshop Home-Page |